International Standard
ISO 9455-18:2024
Soft soldering fluxes — Test methods — Part 18: Cleanliness of soldered printed circuit assemblies before and/or after cleaning
Reference number
ISO 9455-18:2024
Edition 1
2024-08
© ISO 2025
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Published (Edition 1, 2024)

ISO 9455-18:2024

Language
Format
CHF 65
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Abstract

This document specifies test methods for the cleanliness of soldered printed circuit assemblies before and/or after soldering and cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.

General information

  • Status
     : Published
    Publication date
     : 2024-08
    Stage
    : International Standard published [60.60]
  • Edition
     : 1
    Number of pages
     : 12
  • Technical Committee :
    ISO/TC 44/SC 12
    ICS :
    25.160.50 
  • RSS updates

Life cycle

Sustainable Development Goals

This standard contributes to the following Sustainable Development Goal

9
Industry, Innovation and Infrastructure

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