Status : Published

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Abstract

This document specifies a method for measuring the thermal resistance between a heater chip and a cold plate with the heater chip mounted on a metalized ceramic substrate, imitating a silicon carbide (SiC) high-output power module. This measurement represents an index of the heat dissipation characteristics of a metallized ceramic substrate used in a high-output power module.

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General information

  • Status
     : Published
    Publication date
     : 2023-01
    Stage
    : International Standard published [60.60]
  • Edition
     : 1
    Number of pages
     : 12
  • Technical Committee :
    ISO/TC 206
    ICS :
    81.060.30 
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Life cycle

Sustainable Development Goals

This standard contributes to the following Sustainable Development Goals

7
Affordable and Clean Energy
9
Industry, Innovation and Infrastructure
11
Sustainable Cities and Communities
12
Responsible Consumption and Production

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