Abstract

Specifies the requirements for chemical composition for the following soft solder alloys: tin-lead, with and without antimony; tin-silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; lead-silver, with and without tin.


General information 

  • Status
     : Withdrawn
    Publication date
     : 1990-11
  • Edition
     : 1
    Number of pages
     : 4
  • Technical Committee
     : ISO/TC 44/SC 12 Soldering materials
  • ICS
     :
    25.160.50 Brazing and soldering

Life cycle

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