Resumen
This part of ISO 9455 specifies test methods of cleanliness of the Soldered Printed Circuit Assemblies before and/or after cleaning. The test is applicable to all fluxes as defined in ISO 9454-1.
Informaciones generales
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Estado: En desarrolloEtapa: Texto final recibido o FDIS registrado para su aprobación formal [50.00]
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Edición: 1
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Comité Técnico :ISO/TC 44/SC 12ICS :25.160.50
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